Located on-site in San Jose, CA
Overview:
This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. This role involves working on mechanical designs for advanced electronic packaging and optical components.
Essential Skills:
- B.S. or M.S. in Mechanical Engineering, Electrical Engineering, Material Engineering etc.
- Knowledge of Solidworks (or other design packages) to create packaging designs
- Knowledge of FEA (Finite Element Analysis) with Ansys or Abaqus etc.
- Experience working on Thermal, Structural or Strain analysis
- Knowledge of packaging standards including JEDEC
- Has previously worked on 2.5D or 3D Packaging
- Experience with Through-Silicon Via (TSV)
Company Benefits:
- 401K
- Bonus
- Stock/Equity
- Full Premium Healthcare