RF Design Engineer – Advanced Semiconductor Packaging
An advanced semiconductor packaging company is seeking an experienced RF Design Engineer to lead the development of high-performance RF modules, front-ends, and SiPs using innovative glass-based integration technology. You’ll drive designs from concept to production with minimal supervision, applying deep RF and microwave engineering knowledge to cutting-edge 3D heterogeneous integration (3DHI) applications. This would be an on-site role however remote could be a possibility for the right candidate.
Key Responsibilities
- Design RF components such as filters, baluns, couplers, and interposers.
- Integrate active devices (LNAs, PAs) into glass-based SiPs.
- Perform RF, EM, and thermal simulations; validate designs in lab and factory settings.
- Evaluate advanced packaging methods and support prototype builds.
- Collaborate with cross-functional teams and contribute to documentation and proposals.
Qualifications
- Bachelor’s in Electrical Engineering required, Master’s preferred.
- 5+ years of RF design experience (10+ ideal).
- Strong background in impedance matching, RF simulation tools (ADS/AWR), and lab testing.
- Experience with antennas, phased arrays, or high-volume manufacturing is a plus.
- Must meet ITAR/EAR compliance requirements (MUST BE A US CITIZEN)