About the role
Our client is a growing semiconductor manufacturer hiring a hands-on technical leader to own its backend thick copper (bump) integration. The role has full visibility to the executive management team and real room to advance as the company scales.
You’ll be the technical authority in electroplating, leading R&D to expand the company’s current capabilities. Thick copper bump integration typically spans the wider wafer-level packaging flow, including under-bump metallization (UBM), redistribution layers (RDL), and copper pillar formation. Electroplating expertise at this level usually means understanding plating chemistry and additive control (accelerators, suppressors, and levelers), bath analysis methods such as cyclic voltammetric stripping (CVS), and the impact of plating conditions on uniformity and void-free fill. Beyond plating, you’ll lead dicing, etch, and solder ball attach efforts.
Continuous improvement is a core part of the job. You’ll use disciplined problem-solving, design of experiments (DOE), and statistical methods such as SPC to improve quality, yields, production rates, and efficiency, while reducing costs and keeping systems safe and reliable. When failures occur, you’ll find root causes and recommend changes to designs, tolerances, or processes.
You’ll also lead teams and projects, present to company executives, and partner with external companies and universities on the latest integration advances.
Main responsibilities
- Serve as the technical authority in electroplating and lead R&D to expand current capabilities
- Lead dicing, etch, and solder ball attach efforts
- Drive manufacturing continuous improvement using disciplined problem-solving and design of experiments
- Improve quality, yields, production rates, and efficiency while reducing costs and keeping systems safe and reliable
- Partner with external companies and universities on the latest integration advances
- Find root causes of failures using statistical methods, and recommend changes to designs, tolerances, or processes
- Present to company executives and lead teams and projects
Requirements
- BS in Engineering
- 10+ years in a semiconductor manufacturing environment, with solid knowledge of thick Cu (bump) integration
- Working knowledge of photolithography, electroplating, spin-on dielectrics, and laminate films
- People management or program leadership experience
- Strong written and verbal communication, and comfort working across all levels of an organization
- Adaptability in an environment that moves quickly
- US citizenship, US permanent residency, or the ability to meet contract-specific licensure requirements, as the role requires lawful access to ITAR/EAR-controlled information
Nice to have:
- Experience taking processes from R&D to high-volume manufacturing
The offer
- Full-time role
- Full visibility to the executive management team
- Room to advance as the company scales
This role suits a semiconductor process leader with deep electroplating and bump integration experience who wants to own the backend and grow with the company. If that sounds like you, apply below.